The purpose of this workshop is to present and discuss leading-edge developments in material enabled thermal management solutions for removing, spreading, and dissipating heat from microelectronic devices and systems.
The workshop focuses on analysis, simulation and demonstration of high-performance solutions intended to meet current and evolving requirements in power electronics, lightning, automotive and nano-electronics.

Presentations of this Workshop (preliminary titles):

  • "Thermometry of self-heated devices on micro- and nanoscale"
    B. Gotsmann, Science & Technology department at IBM Research – Zurich, Switzerland
  • "Thermal management for Power Systems"
    H. Pairitsch , Technology & Innovation, Infineon Technologies Austria AG, Villach, Austria
  • "Multiscale Thermal Transport"
    R. Hammer, Materials Center Leoben Forschung GmbH, Leoben, Austria
  • " Virtual prototyping for thin packages"
    T. Krivec, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, Austria
  • "The Quest for Robustness in Electronic Assemblies"
    D. Kieslinger, ZKW Elektronik GmbH, Wiener Neustadt, Austria
  • "Reliability testing and analysis"
    E. Kraker, Materials Center Leoben Forschung GmbH, Leoben, Austria
Thermal management, image: MCL
During the operation of the component on the printed circuit board heat is generated and can be detected via thermal transient measurements. The quality of the soldering (yellow) between the component and the printed circuit board can be visualised via computed tomography; image: MCL

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